Applied






» Download Presentation
» Technical Papers
» Heat Sink Design Optimization
» Equipment Testing
» Heat Sink Design Software
» Electronics Cooling Workshop
» Preliminary Thermal Feasibility Study
» Our Team
» Air Flow Calculator
» Careers at Applied


Cool Products by Design
Applied Thermal - Industry Leader in Electronics Cooling Solutions,
Thermal Management, Thermo Fluid and Air Delivery Design and Consulting

Since 1997, APPLIED THERMAL engineers have solved cooling challenges in over 250 products, ranging from networking, telecom, and consumer electronics to power and biomedical devices. Our clients include Cisco, Juniper Networks, Apple, Microsoft, Intel, HP, Sun Microsystems, Bio-Rad, Huawei, Mitsubishi, Panasonic, Dell, IBM, Lockheed-Martin, GE, Samsung, and other leading companies worldwide.


We offer:
  • global design services for electronics cooling

  • board level, chip level, package level, room level thermal analysis and experimental validation

  • CFD analysis for equipment design, aero thermal design, ventilation and transport (using Icepak, Fluent, AirPak, Ansys/CFX, CFD-ACE+, FloTherm)

  • heat sink design, selection and customization using CFD/FEA/QFin and experimental methods

  • experimental verification and validation of cooling solutions by means of wind tunnel and environmental chamber testing, thermal anemometry, etc

  • structural analysis for equipment design using ANSYS

  • educational classes and seminars on various aspects of practical heat transfer and electronics cooling


» Consumer Electronics
» Networking and Telecom
» Power Electronics
» Biomedical Devices
» Automotive Systems
» Packaging & Components
» Solar Cells


For more information about our services, please click on the links below:

» Thermal Consultants
» Presentation

You can view us simply as an extension of your product development team.


We will work with your industrial designs (CAD files) and will help you to reduce energy consumption, size, cost, noise and improve overall time-to-market.

We will do that by improving air circulation and air flow delivery, improving heat sink designs (improving design to reduce junction temperature and reducing mass, simplifying the design for manufacturability) and by verifying experimentally that proposed solutions do work well. We reduce noise by finding flow paths to cool more effectively, so that we can use fans working at lower db level. With our typical project turn around time being one to two weeks and our instant availability - your time-to-market will be well assured.

You can have confidence that your thermal solutions had been scrutinized, optimized and verified by the leading industry experts who have worked before on cooling of every imaginable electronics and board configuration or design.


Sign up for one of our thermal cooling workshops
Learn how to solve electronics cooling problems at the component, board, and system levels.









©2008 Applied Thermal Technologies, LLC. All Rights Reserved