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Client: Apple
Project Objectives:
Find a thermal solution for the CPU, HD, and graphics chip that
- Fits within the thin form factor of laptop base
- Does not add significantly to the weight of the product
- Generates minimal, if any, noise
Achievements:
Several types thin heat spreaders were investigated to eliminate the hot spots caused by the individual components.
Although it was demonstrated that a carbon fiber spreader was best in terms of weight reduction and thermal performance, an aluminum spreader with heat pipe was used due to manufacturability issues.
Due to the power density of the system, it was shown that a fan was necessary to help cool the system. Using both simulations and experiments on prototypes,
Applied Thermal identified a control scheme for the fan to minimize noise, depending on how hard the system was working.
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