Client: Rambus

Project Objectives:
Identify the worst-case power distribution for components on the module. Design a low-cost thermal solution for the module.

Achievements:
Since any combination of the 8 or 16 memory packages on a module could be dissipating significant power, effective spreading of the localized heat over all of the components was shown to be essential. A thin, cheap aluminum stamping was demonstrated to provide adequate spreading. A compliant package-to-spreader interface material was then identified to accommodate the flex of the stamped spreader and package tolerances, without thermally insulating the exposed memory chips.

Client: Credence

Project Objectives:
Find an air-cooled thermal design for the test head using proven technologies. The design must not interfere with the robotic manipulator or attachment to the device-under-test.

Achievements:
A twin-backplane V-shaped card cage design, in conjunction with a bank of 8-inch axial flow fans and flow-metering screens, was shown to provide plenty of.

• Intel
• Transmeta
• Blaze Networking Products
• Mitsubishi
• Western Digital
• IBM
• Schlumberger
• Cadence (Quickturn)
• Light Logic
• MKS
• Raychem
• Others