When you have a hot component that you want to cool at the lowest overall cost, Applied Thermal Technologies has the tools you need. We begin by determining the overall thermal performance of the board relative to the system environment. Our next step is to understand the effects of component placement and recommend improvements to minimize the cost of adding heat sinks or other thermal hardware. If required, we design a cost-effective heat sink and determine the overall effect of the heat sink on the board and system performance. We provide detailed heat sink/device/board thermal performance predictions through modeling and actual test validation. Pro-E or AutoCAD designs are provided for any required heat sinks.