With the ever-present goal of increased functional integration and decreased sizes in both integrated circuits and their the problem of effective temperature control has become a major industry concern. Further optimization of silicon patterning technology and device placement has only increased device density and ultimately component heat flux. This puts increased focus on board design, heat sink to device interface materials and heat sink spreading resistance. By working with you at the die level, Applied Thermal Technologies can help you keep your device cool, no matter what package or system it ultimately goes into. Working with leading chip and packaging companies, Applied has developed custom device lids and spreaders to optimize electrical performance through effective device cooling and sound structural control.