As electronic systems increase in sophistication and package size decreases, the need to dissipate excess heat becomes both more essential and more difficult. Applied Thermal uses a proven methodology to help you design your system, board, or package for the most efficient and cost-effective heat dissipation.

We will work with you from the product concept phase through final system testing. Coordination with you from the beginning shortens design time, eliminates excessive prototyping, and saves redesigns late in the product design cycle.

However, in the event that you have an existing design that is exhibiting thermal failure, we can also help you to rapidly isolate and correct the problem. Applied Thermal uses state-of-the-art thermal modeling software, in conjunction with a well-equipped test lab, to optimize designs in progress and resolve issues with existing products.

For a list of typical projects that we conduct please click on this link.