Farzam Roknaldin, Ph.D. in Mechanical and Aerospace Engineering, Stanford University, California, Principal Engineer/Consultant.
Dr. Roknaldin has diverse background in Thermal Management of Electronic Equipment, Computational fluid dynamics, Aerodynamics, Thermal systems, Aero-acoustics, and Finite element methods in fluid and solid mechanics. He is serving as part time faculty in Mechanical Engineering Department at San Jose State University where he teaches courses in fluid/thermal science and conducting research in thermal management through his graduate students.
Farzam is a Principal Engineer/Consultant at Applied Thermal Technologies, a thermal management company located in Silicon Valley that focuses on innovating thermal solutions for electronic equipments. His thermal designs already in the market range from small hand held electronic devices to large telecommunication server racks. To come up with a particular cooling solution, with reliable thermal/fluid performance, he employs Computational fluid dynamics tools followed by laboratory measurements. Prior to his involvement in electronics cooling he conducted research in Aero-acoustics and Large Eddy simulation of turbulent flow over aerodynamic bodies. Methodology developed in his research is applicable to variety of engineering problems ranging from capturing aerodynamic noise radiated from remotely piloted planes to analyze generated noise from cooling fan commonly used in computer and telecommunication equipments.

Paul Karayacoubian, MS in Mechanical Engineering, University of Waterloo, Canada: Advisory Engineer. At the University of Waterloo in Canada he worked with Professors J. R. Culham and M. M. Yovanovich who are considered pioneers in the field of thermal contact resistance. His research was related to modeling and characterizing effective thermal conductivity of thermal greases used to minimize thermal contact resistance in microelectronics and space applications. He also performed CFD analyses for RWDI, a wind engineering and building science consulting firm in Canada.
At Applied Thermal Technologies Paul worked on chip-, board-, and system-level analysis using both computer simulations (Icepak) and experimental wind tunnel studies. He has worked on small form-factor servers and laptop solutions requiring innovative solutions with phase-change thermal interface materials and heat pipes as well as custom heat sinks. He has also done various experimental tests in the lab including an experimental optimization study for a next-generation server for the medical devices industry.

Avijit Goswami, Ph.D. in Mechanical Engineering, is the managing director of Applied Thermal Technologies. Prior to this he was leading Applied Thermal Technologies, India. During his 15 year career in fluid mechanics and heat transfer, he has worked on a wide range of applications in electronics cooling. These involved experimental, analytical and numerical analysis of heat transfer problems. He obtained his Ph.D. from Stanford University specializing in the area of Turbulence Modeling and Computational Fluid Dynamics. Dr. Goswami earned his B.Tech. (1988) from the Indian Institute of Technology, Bombay, M.S. from the University of Texas at Arlington, TX, in the field of Mechanical/Aeronautical Engineering.
In addition, he has published and presented several papers in international journals and conferences on CFD and heat transfer. He has designed cooling solutions for many electronic equipment including laptop and desktop computers, servers, networking and telecommunications systems. He has also taught electronics cooling courses around the world since 1999.

Jon Matheson, MS in Aeronautics/Astronautics Engineering, Stanford University, California, Advisory Engineer. Jon has a background in Mechanical Engineering and Physics (B.Eng., B.Sc. Dalhousie University, Canada) and has been actively involved in Computational Fluid Dynamics (CFD) research throughout. His main research interest is in the area of applied aerodynamics and simulation in motor sports. Jon has worked on thermal solutions for a variety of projects including rack servers, desktop computer systems, and laptops. In addition to thermal design he has also been involved with electric vehicle battery research, preliminary wind / tidal power projects, CFD design for ultra high mileage vehicles, and open-wheel race car structural / systems design.