In this one-day course, you will learn how to design and select heat sinks for electronic devices and power equipment. Emphasis is placed on both understanding fundamental heat transfer processes involved in cooling electronics and the current state-of-the-art in heat sink technology. Example problems guide you through the calculation and optimization of heat sink thermal performance.

This course also includes an introduction to a heat sink design software (QFin). The instructors will demonstrate how to efficiently solve several sample or student problems using QFin.

Who Will Benefit:
This course is recommended for thermal, mechanical and electrical design engineers working in electronics and power industires.

Course Fee:
Registration fee of $700 per person includes one day of lectures, a comprehensive set of notes, lunch and refreshments.

Course Outline:
Introduction Thermal Design Criteria
Levels of Thermal Analysis
Thermal Analysis and Design Process

Fundamentals of heat transfer
Conduction
Convection
Radiation
Fins and Heat Sinks

Interface Materials
Contact Resistance and Interface Materials
Properties of Interface Materials
Types of Interface Materials

Package Level Thermal Analysis
Package Thermal Resistance
Heat Sink Thermal Resistance
Heat Sink Selection

Heat Sink Technologies
Types of Heat Sinks
Passive and Active Heat Sinks
Heat Sink Selection
Heat Sink Attachment and Interface Materials

Heat Sink Desing and Optimization
Environmental and Physical Conditions
Initial Feasibility Study
Preliminary Heat Sink Desing
Heat Sink Optimization

Heat Sink Design Using QFin

Sample and Student Problems