In this two-day course, you will learn about the latest developments in analysis, modeling, and design at the component, board and system levels. There is discussion of the current state of thermal management with special emphasis on the cooling requirements of today's and tomorrow's components and systems. You review the fundamental concepts of heat transfer, as well as the state-of-the-art in analytical, numerical, and experimental analysis approaches.

The instructors provide insight into designing cooling systems for the component, board and system levels. They relate, through actual case studies, the successful application of thermal management techniques to today's most challenging cooling problems.

Who Will Benefit:
This course is recommended for thermal, mechanical and design engineers working in electronics industry including telecomm, consumer, power, medical, automotive and military electronics.

Course Fee:
Registration Fee of $1,100 per person includes two days of lectures, a comprehensive set of notes, refreshments and lunches.

Course Outline:
Thermal Packaging Trends
Device and Packaging Trends
National Technology Roadmap for Semiconductors
Thermal Packaging Options and Trends

Heat Transfer Principles
Conduction
Convection
Radiation
Thermal Resistances
Typical Thermal Resistances

Analytical Techniques
Descrete Heat Sources and Interface Resistance
Thermal Spreading Resistance
Thermal Contact Resistance
Compact Package Thermal Models
Natural Convection from Printed Circuit Boards

Problem Solving Approach
Principles of Thermal Management
Thermal Analysis and Design Process
Levels of Thermal Analysis
Typical Examples of the Back of the Envelope Calculations

Fins and Fin Arrays
Single Fins - Governing Equation
Single Fins - Least-Material Optimization
Heat Sink Thermal Performance
Heat Sink Least-Material Optimization

Heat Sink Selection
Heat Sink Thermal Resistance
Types of Heat Sinks
Passive and Active Heat Sinks
Selecting the Right Heat Sink
Heat Sink Attachment and Interface Materials

Experimental Methods
Airflow measurement
System Impedance Curve Measurement
Fan Curve Measurement
Velocity Measurement
Temperature Measurement

Advanced Thermal Management Techniques
On-Chip Thermoelectric coolers
Microchannel coolers
Spray Cooling

Numerical Techniques
Advantages of CFD
Limitations of CFD
System Design
Board Level Design

Stringent Thermal Management Applications
Discussion of the thermal management of special applications such as military, automotive and outdoor Electronics

Case Study: Evaluation of Airflow Prediction Methods in Compact Electronic Enclolsures
Airflow Prediction Methods: Experimental, Performance Curve, and CFD
Effect of Grille Open Area
Change in Fan Size
Fan is Series and Parallel

Case Study: Thermal Design of a Telecom Product
Initial DesignConcept
Design Goals, Potential Concepts, Design Parameters
Preliminary CFD Model of System
Study Variation of the Base Model
Aiorflow Testing and Veification
Design Optimization
CPU Board Modeling
Heat Sink Design and Optimization

Questions and Answers and Discussion